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Welcome to the web site of AMPS Technologies Company, the developer of the AMPS (Advanced Multi-Physics Simulation) programs.

Please register to get access to more AMPS product information and for hand-on evaluation software.

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(August 1, 2016) We are pleased to announce that AMPS 8.0 beta release is now available for download.  The 8.0 products lines include a brand new XMD (XML Model Database) technology that enables all AMPS and partnership products to have a two-way exchangability so users can switch from different CAD/CAE tool to/from AMPS and among the different partner products, while keeping each individual proiduct's unique local features/functions. XMD technology encapulated the FEA model in object classes so application development can move on quickly without extensive API document and lengthy interface details. The technology also speeds up new generation Sefea technology development, eases technology adoption for partners, and brings further usabilities to customers in faster cycles.

(May 20, 2016) AMPS Technologies and IronCAD, LLC has jointly donated AMPS and IronCAD product to National Taiwan University and National Taiwan University of Science and Technology. These two leading universities plan to use the 3D CAD and Multiphysics CAE software for teaching and researches (press release)

(Jan 8, 2016) AMPS 7.0 is now available for download. This release contains many important new features and an updated interface. The updates include 2nd generation SefeaTM (Strain-Enriched FEA) formulation for solid, shell, coupled fluid-structure and electromagnetic applications. Other important features include moving-least-squares (MLSFEA) energy-based tying for large scale tying to overcome CAD part imperfection,  enhanced interactive sidebar for streamline and cut-plane result contouring, new fluid inflow/outflow for severely shorten flow domain, and many more.

(Nov 9, 2015) We are extremely pleased to jointly announce Multi-Physics for IronCAD 2016 release with IronCAD, LLC. MPIC 2016 release now includes fluid on top of  solid, electrical and thermal physics in an integrated product based on the SefeaTM LSFEA technology, and is one step further for CAD users and designers to perform instant what-if design analysis that used to take days or multiple tools to achieve. Evaluation version is immediately available at MPIC download

 

 

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